What Are the Two Packaging Methods of Outdoor LED Display?

DIP Encapsulation of Outdoor LED Display

DIP stands for dual inline-pin package, commonly known as plug-in lamp-style LED displays. The LED chips are produced by a LED chip packaging factory, and then inserted into the LED circuit board lamp board, and then produced through wave soldering to make semi-outdoor LED unit board and outdoor waterproof LED unit board.

In the early stage, red, green, and blue lights were inserted into PCP to form an RG pixel; in the later stage, three RG three chips could be packaged in one bulb, that is, a three-in-one full-color outdoor LED display.

However, whether it is single lamp RGB or three-in-one RGB, the dot pitch is limited by the diameter of the lamp bead, and it is difficult to achieve higher density outdoor display screens. The protective performance is good, but the viewing angle is fixed and inaccurate, usually between 100°-110°, suitable for outdoor long-distance display screens.

At present, the production of DIP displays is complex and difficult to achieve mechanized production, and the production efficiency is low. The quality of the display screen depends on the quality of the LED chip packaging factory, and each batch cannot be well controlled, so the quality is unstable.

In addition, many DIP manufacturers of outdoor LED displays do not have high technical and equipment thresholds, and the competition is fierce. Many manufacturers use inferior raw materials and low-quality PCB boards to reduce costs and gain market share without perfect after-sales guarantees.

The appearance of DIP products is rough, the viewing angle is only 100-110 degrees, the quality is low, the energy consumption is high, the environmental protection is low, the price is low, and it still occupies a strong market share in the outdoor P8-P20 market.

SMD Encapsulation of Outdoor LED Display

SMD encapsulation stands for Surface Mounted Devices, which is one of the components of Surface Mount Technology (SMT). Surface mount components were introduced about twenty years ago, heralding a new era.

From passive components to active components and integrated circuits, they will eventually evolve into surface mount devices (SMDs) that can be assembled by pick-and-place devices. For a long time, it was believed that all pin components could be encapsulated in SMDs. SMD technology is widely used in outdoor LED displays.

Three-in-one is an SMD technology of LED displays, which encapsulates SMT lamps with three different color LED chips at a certain distance in the same glue.

The overall viewing angle of the full-color outdoor LED display with three-in-one chip package technology is larger than that of DIP, and the surface can undergo light diffused reflection treatment, without particle effect, and good color uniformity.

In terms of color, three-in-one full color is easier to separate than three-splice one, and the color saturation is high. The entire surface of the three-in-one emits light, so the color of the entire three-in-one is more uniform.

The overall flatness of the three-in-one is easier to control and has become a standardized technology for the outdoor LED display.